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0563-6725566
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TD004
It is made of PET as the substrate and coated with hot melt adhesive and pressure sensitive adhesive on both sides. It has high viscosity, acid and alkali resistance, and be suitable for semiconductor and glass grinding.
Features
Product parameter
Features
Great peeling force
Acid and alkali resistance
Tear without residual glue
| 厚度（μm） | 宽度（mm） | 180°剥离（g/25mm） | 常温持粘（Hr） | 耐水煮 | 耐碱 |
|---|---|---|---|---|---|
| 180±10 | 1360/1560 | H0tmelt:>5000，Psa:>1800 | >72hr | PASS | PASS |
